Documents required for Intrinsic Safety Projects

Documents required for Intrinsic Safety Projectsintrinsic safety

The manufacturer must demonstrate to the Certification Body how compliance has been achieved, for example, which tables and annexes have been applied and why, which components are rated as safety components and the general methodology for certification including:

1. Documents – all documents shall be controlled with an ID, revision level, and responsible designer, reviewer (if applicable) and approver at the submission stage (so that we are working from the same document levels)
a. Descriptive about how you have planned the intrinsically safe protection according to the applicable requirements of IEC 60079-0:2011 (see Table 1 at IEC 60079-11 for the applicable clauses) and IEC 60079-11:2011
b. General assembly drawings showing all the parts, their materials specifications – for the enclosure metallic parts see clause 8 of IEC 60079-0 and for non-metallic parts see clause 7.4 of IEC 60079-11:2011
c. Encapsulation drawing covering all the requirements from clause 6.6 of IEC 60079-11
d. Board electric schematics – Make sure that the infallible components are highlighted (if applicable), where wiring is used, it shall also be fully specified as well as connectors
e. Bill of materials – If you are not relying on encapsulation to cover the temperature classification requirements, then you must to provide all the components with their surface area and thermal resistance. Normally, on this review we work with an Excel file to make easier the assessments and reporting
f. Datasheet of all components, connectors and wiring
g. Specification of the board with tracks layers diagram, minimum tracks width applied on each layer
h. Descriptive about how the requirements of clause 6.3 of IEC 60079-11 for infallible separation distances have been applied (if your design require infallible separation distances)
i. Descriptive about how the requirements of clause 8.8 of IEC 60079-11 for infallible connections have been applied (if your design require infallible connections)
j. BOM in spreadsheet form, ideally with values and tolerances in columns so that they can be easily added/amended.
k. All calculations to demonstrate rating of critical components (transients, wattage de-rated (for temperature, heat-sink etc.) as per datasheet and standard
l. Fuse/semiconductor transient assessment as necessary

If the listed documents/requirements are not submitted on application and have to be required during the course of the project, significant delays may occur.